Specifications

Processor System

CPU System

Dual CPU from the New Intel® Xeon® Processor Scalable Family up to 28 cores, 165W

Core Logic

Chipset

Intel® C622 chipset (optional variants with C625, C626, C627, and C628)

Memory

Technology

Up to 24x 2666MHz DDR4 ECC Standard ECC RDIMM/LRDIMM

Max Capacity

Max capacity per channel: 64GB

Max total capacity per system: 1536GB

Socket

24x 288-pin DIMM

PCIe

Expansions Slots

Total 4x PCIe x16 (FH/¾L) slots

Ethernet

Gigabit Ethernet Interface

10/100/1000 Mbps

10GbE Ethernet Interface

1Gbps / 10Gbps

Controller

GbE LAN1: Intel i210-AT, GbE LAN2: Intel i210-AT 10GbE SFP+ LAN1/2: OCP Mezzanine card SFI (from PCH)

Connector

2 x RJ-45, 2 x SFP+

Security

 

TPM 2.0 module by LPC

Onboard I/O Connector

Front IO

1x PWR button, 1x ID button, 2x USB3.0/2.0, 1x RJ45 console, 5x LEDs (Power, ID, 3x SW definable), 1x VGA port, 2x 10GbE SFP+

Rear IO

2x GbE LAN RJ45, 2x hole ground lug

Front I/O Interface

 

2 x USB2.0, PWR, ID Button, Status LEDs

Storage

 

4x 2.5″, hot-swappable, SAS/SATA HDD/SSD trays in front (SAS drives supported via HBA/RAID adapter on PCIe slots)

2x M.2 2280 SATA SSD

System Management

IPMI

Aspeed AST2500 BMC

Advanced Lights Out Management

Compliant to IPMI 2.0 with security &

Availability enhancements

iKVM Support Advantech Web GUI style

node manager

Configurable shared or dedicated NIC

support

 

Cooling

Chassis Fan

Six 40 x 56 mm replaceable, hot swappable

fans

Thermal Control

Three separate thermal zones for

motherboard and PCIe cards

Reliability

Resilient to single fan failure

Power Supply

Power Rating

1200W red. AC PSU / (Optional) 800W red. AC PSU

Input

(AC) 200-240Vac, 7.08A, 47-63Hz

Physical Characteristics

Dimension (W x D x H)

438.00 x 749.7 x 44.20 mm (17.24″ x 29.50″ x 1.74″)

Weight (N.W.)

20kg

Environment

Humidity Operational (non-condensing)

5% to 85%

 

Operational Temperature

 0°C (32°F) to 40°C (104°F)

 

Storage Temperature

-40°C (-40°F) to 70°C (158°F)

 

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